- 期刊
Auto Mode IC Mold Flow by Uniform Filling Principle
充填均一性探討自動模IC封裝之研究
並列摘要
This study is to investigate auto mode IC mold flow behavior in multi-injection and simulate filling, pack and war page. In this research, we use Moldex3D software to find melt-front, air trap and welding line for different injection modes.
延伸閱讀
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